Author:
Henttonen Timo,Mescher Paul,Scott Doug,Park Han,Ko YongJae,Engel Kevin
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Creep characterization of lead-free solder alloys over an extended temperature range used for fatigue modeling;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Comparative study of solder joint reliability assessment on fan-out CSP and flip-chip DCA package;Journal of Materials Science: Materials in Electronics;2023-11
3. Single Factor Study of Solder Joint Reliability for MCP Packages;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24
4. Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling;2023 IEEE International Reliability Physics Symposium (IRPS);2023-03
5. Solder Joint Reliability Assessment on FO-CSP for Next Generation DDR6;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07