Single Factor Study of Solder Joint Reliability for MCP Packages-Reference-Cited by-同舟云学术

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Single Factor Study of Solder Joint Reliability for MCP Packages

Published:2023-07-24 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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Author:

Liu Vance¹,Chen Chien-Min¹,Low Peng Wang²,Gan Chong Leong¹

Affiliation:

1. Micron Technology,Packaging Development Department,Taichung,Taiwan

2. Micron Technology,Packaging Development Department,Singapore

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10248978/10248979/10249136.pdf?arnumber=10249136

Reference22 articles.

1. Effect of solder joint parameter on vibration fatigue reliability of high density PCB assembly

2. Influence of Ball Grid Array Design Parameters on Solder Joint Reliability

3. Effect of geometry and temperature cycle on the reliability of WLCSP solder joints

4. Lifetime prediction and impact factors analysis of ball grid array solder joint based on FEA

5. Study on Substrate Crack through Experiment and Simulation on SSD BGA under Temperature Cycling

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Solder joint reliability performance study and shear characterization of low-Ag SAC lead-free solders for handheld application;Materials Science in Semiconductor Processing;2024-08

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