Comparative study of solder joint reliability assessment on fan-out CSP and flip-chip DCA package
Author:
Funder
Micron Technology
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.1007/s10854-023-11546-9.pdf
Reference43 articles.
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2. J.H. Lau, Fan-Out Wafer-Level Packaging (Springer, New York, 2018)
3. J.H. Lau et al., Fan-Out wafer-level packaging for heterogeneous integration. IEEE Trans. Comp. Packag. Manuf. Technol. 8(9), 1544–1560 (2018). https://doi.org/10.1109/TCPMT.2018.2848649
4. J. A. Lim, B. -C. Kim, R. Valencia-Gacho and B. Dunlap, 2022 "Component Level Reliability Evaluation of Low Cost 6-Sided Die Protection versus Wafer Level Chip Scale Packaging with 350um Ball Pitch," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 2022, pp. 1791-1797, doi: https://doi.org/10.1109/ECTC51906.2022.00282.
5. M. -C. Hsieh and S. -L. Tzeng (2014) Solder joint fatigue life prediction in large size and low cost wafer-level chip scale packages, In: 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, pp. 496–501, https://doi.org/10.1109/ICEPT.2014.6922704.
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