Effect of Bismuth Content on the Mechanical Cyclic Properties of SAC+Bi Lead Free Solders
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501920.pdf?arnumber=9501920
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of Bi on the Tensile and Viscoplastic Behavior of Sn-Ag-Cu-Bi Alloys Used for Microelectronics Applications;Metals;2024-07-09
2. Creep characterization of lead-free solder alloys over an extended temperature range used for fatigue modeling;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
3. Contribution to the Calorimetric Study of the Bi-Ni-Sn Ternary System: Experimental and Theoretical Data;Biointerface Research in Applied Chemistry;2022-07-10
4. High Strain Rate Mechanical Properties of M758 Solder at Extreme Surrounding Temperatures, with 100°C Isothermal Aging for up to 180 Days;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
5. Mechanical Behavior and Microstructure Evolution in SAC+Bi Lead Free Solders Subjected to Mechanical Cycling;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
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