Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference13 articles.
1. Developing lead-free solders: A challenge and opportunity
2. Fatigue crack-growth behavior of Sn-Ag-Cu and Sn-Ag-Cu-Bi lead-free solders
3. Fatigue crack growth behaviour of lead‐containing and lead‐free solders
4. M.A. Whitemore, P.G. Harris, K.S. Chaggar, A.C. Hilton, Presented at NEPCON Europe, Middlesex, UK, 1990.
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