Effects of bismuth additions on mechanical property and microstructure of SAC-Bi solder joint under current stressing-Reference-Cited by-同舟云学术

Effects of bismuth additions on mechanical property and microstructure of SAC-Bi solder joint under current stressing

Published:2021-02 Issue: Volume:117 Page:114041
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Hu Siou-Han,Lin Ting-Chun,Kao Chin-Li,Huang Fei-Ya,Tsai Yi-Yun,Hsiao Shih-Chieh,Kuo Jui-Chao

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference41 articles.

1. Lead-free Solders in Microelectronics

2. A. El-Daly, G. Al-Ganainy, A. Fawzy, et al. Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0 Ag–0.5 Cu lead-free solder alloy. Mater Eng (Reigate, U. K.). 2014;55:837–845.

3. A. El-Daly, A. El-Taher, T. Dalloul, Improved creep resistance and thermal behavior of Ni-doped Sn–3.0 Ag–0.5 Cu lead-free solder. J Alloys Compd. 2014;587:32–39.https://doi.org/10.1016/j.jallcom.2013.10.148.

4. Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate

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