Influence of Nickel and Bismuth Addition on the Mechanical Shear Strength of SAC+ Ni, Bi Solders under Isothermal Aging and Multiple Reflows
Author:
Affiliation:
1. Watson Institute of Systems Excellence,Binghamton,USA
2. Analog Devices,Wilmington,USA
Funder
Analog Devices
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565269.pdf?arnumber=10565269
Reference29 articles.
1. Effect of Aging Temperature on the Fatigue Resistance and Shear Strength of SAC305 Solder Joints
2. Design, process, and assembly characterization using via-in-pad plated over design in multilayer nvdimm printed circuit boards;Rout,2022
3. Process Development, Thermal Characterization and Reliability Study of a Differential DIMM Using a DDP DRAM Package;Patra,2022
4. High Temperature Aging Effects in SAC and SAC+X Lead Free Solders
5. Effect of multiple reflows on interfacial reaction and shear strength of Sn–Ag electroplated solder bumps for flip chip package
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