Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference42 articles.
1. Issues in the replacement of lead-bearing solders
2. Lead-free Solders in Microelectronics
3. Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity
4. The creep properties of lead-free solder joints
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