Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference29 articles.
1. A constitutive model for creep of lead-free solders undergoing strain-enhanced microstructural coarsening: A first report
2. Microstructure evolution of eutectic Sn-Ag solder joints
3. Influence of microstructure size on the plastic deformation kinetics, fatigue crack growth rate, and low-cycle fatigue of solder joints
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2. The role of microstructure in the thermal fatigue of solder joints;Nature Communications;2024-05-20
3. Effects of Ag content on microstructure evolution, intermetallic compound (IMC) and mechanical behaviour of SAC solder joints;Microelectronics Reliability;2023-08
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5. The Effects of Thermal Exposure on the Creep Behavior of SAC+Bi Lead-Free Solders;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
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