Influence of microstructure size on the plastic deformation kinetics, fatigue crack growth rate, and low-cycle fatigue of solder joints-Reference-Cited by-同舟云学术

Influence of microstructure size on the plastic deformation kinetics, fatigue crack growth rate, and low-cycle fatigue of solder joints

Published:1999-09 Issue:9 Volume:28 Page:1062-1070
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Conrad H.,Guo Z.,Fahmy Y.,Yang Di

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-999-0184-x.pdf

Reference26 articles.

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2. O.N. Senkov and M.M. Myshlyaev, Acta Metall. 34, 97 (1986).

3. Z. Guo and H. Conrad, Trans. ASME J. Electron. Pkg. 118, 49 (1996).

4. Z. Guo and H. Conrad, Advances in Electron. Pkg.—Interpack ’95, ASME EEP-Vol. 10-2 (1995) p. 1129.

5. Z. Guo and H. Conrad, 1993 Electron. Components and Technol. Conf., IEEE CHMST 93CH3205-2 (1993), p. 831.

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