Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5Cu solder
Author:
Funder
Engineering and Physical Sciences Research Council
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference86 articles.
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2. Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates;An;Microelectron. Reliab.,2014
3. Dependence of Sn grain morphology of Sn-Ag-Cu solder on solidification temperature;Arfaei;J. Electron. Mater.,2012
4. Crystallographic aspects of geometrically-necessary and statistically-stored dislocation density;Arsenlis;Acta Mater.,1999
5. Climb-enabled discrete dislocation plasticity;Ayas;J. Mech. Phys. Solid.,2014
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