Preparation of SAC305 Solder Specimens that mimic the Microstructures of a Micro Solder Ball
Author:
Affiliation:
1. Hanyang Universtiy,Department of Mechanical Convergence Engineering,Seoul,South Korea,04763
2. University of Maryland,Mechanical Engineering,College Park,MD,USA,20742
3. DUKSAN HI-METAL Co., LTD.,Ulsan,South Korea,44252
Funder
Hanyang University
National Research Foundation of Korea
Korea Institute of Energy Technology Evaluation and Planning
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565202.pdf?arnumber=10565202
Reference14 articles.
1. Advanced Statistical Model Calibration to Determine Manufacturing-Induced Variations of Effective Elastic Properties of SAC Solder Joints in Leadless Chip Resistor Assemblies
2. Solder joint reliability in automotive applications: Analysis methods and assessment criteria
3. Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints
4. Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5Cu solder
5. Thermal aging study of encapsulated power devices under autonomous driving condition and its effect on board level reliability
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