Funder
Rolls-Royce
Royal Academy of Engineering
Engineering and Physical Sciences Research Council
Reference56 articles.
1. Effect of Sn grain morphology on failure mechanism and reliability of lead-free solder joints in thermal cycling tests;Arfaei;SMTA Int,2013
2. Reliability and failure mechanism of solder joints in thermal cycling tests;Arfaei,2013
3. Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pb-free solder joints;Bieler;Ieee T. Compon. Pack T,2008
4. The role of elastic and plastic anisotropy of Sn in recrystallization and damage evolution during thermal cycling in SAC305 solder joints;Bieler;J. Electron. Mater.,2012
5. A mechanistic thermal fatigue model for SnAgCu solder joints;Borgesen;J. Electron. Mater.,2018
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