A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints-Reference-Cited by-同舟云学术

A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints

Published:2018-02-15 Issue:5 Volume:47 Page:2526-2544
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Borgesen Peter,Wentlent Luke,Hamasha Sa’d,Khasawneh Saif,Shirazi Sam,Schmitz Debora,Alghoul Thaer,Greene Chris,Yin Liang

Funder

U.S. Department of Defense

National Science Foundation

IEEC

AREA Consortium

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/article/10.1007/s11664-018-6121-0/fulltext.html

Reference70 articles.

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3. P. Borgesen, J. Jiang, L. Wentlent, M. Meilunas, R. Sivasubramony, L. E. Alvarez, T. Alghoul, and C. Greene, in Proceedings of SMTA International, Rosemont, IL, USA, 2017.

4. L. Lehman, Y. Xing, T. Bieler, and E. Cotts, Acta Mater. 58, 3546 (2010).

5. D.W. Henderson, J.J. Woods, T.A. Gosselin, J. Bartelo, D.E. King, T.M. Korhonen, M.A. Korhonen, L.P. Lehman, E.J. Cotts, S.K. Kang, P. Lauro, D.-Y. Shih, C. Goldsmith, and K.J. Puttlitz, J. Mater. Res. 19, 1608 (2004).

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