Microstructures and shear strengths of W-ball solder joints aged under isothermal and cyclic thermal conditions-Reference-Cited by-同舟云学术

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Microstructures and shear strengths of W-ball solder joints aged under isothermal and cyclic thermal conditions

Published:2023-03 Issue:8 Volume:34 Page:
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Wang Wenhui,Zhao Xingke^ORCID,Zhao Zenglei,Rong Yuhan

Funder

The Key-Area Research and Development Program of Guangdong Province

The Scientific and Technological Innovation Foundation of Foshan Government

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s10854-023-10065-x.pdf

Reference48 articles.

1. J. Huang, M. Zhou, S. Liang, X. Zhang, Size effects on the interfacial reaction and microstructural evolution of Sn-ball/Sn30Ag05Cu-paste/Cu joints in board-level hybrid BGA interconnection at critical reflowing temperature. J. Mater. Sci. 29(9), 7651–7660 (2018). https://doi.org/10.1007/s10854-018-8758-0

2. I. Shohji, H. Mori, Y. Orii, Solder joint reliability evaluation of chip scale package using a modified Coffin-Manson equation. Microelectron. Reliab. 44(2), 269–274 (2004). https://doi.org/10.1016/j.microrel.2003.08.015

3. J. Ren, M.L. Huang, Board-level drop reliability and fracture behavior of low-temperature soldering Sn–Ag–Cu/Sn–Bi–X hybrid BGA solder joints for consumer electronics. J. Mater. Sci. 32(11), 15453–15465 (2021). https://doi.org/10.1007/s10854-021-06094-z

4. A. Bandaram, Reliability of solder attachment options with lead free for 0.4 mm micro BGA packages. http://hdl.handle.net/10415/2626

5. P. Borgesen, L. Wentlent, S. Hamasha, S. Khasawneh, S. Shirazi, D. Schmitz, T. Alghoul, C. Greene, L. Yin, A mechanistic thermal fatigue model for SnAgCu solder joints. J. Electron. Mater. 47(5), 2526–2544 (2018). https://doi.org/10.1007/s11664-018-6121-0

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