Solder joint reliability evaluation of chip scale package using a modified Coffin

Solder joint reliability evaluation of chip scale package using a modified Coffin–Manson equation

Published:2004-02 Issue:2 Volume:44 Page:269-274
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Shohji Ikuo,Mori Hideo,Orii Yasumitsu

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Solder joint fatigue life of fine pitch BGAs––impact of design and material choices;Darveaux;Microelectron. Reliab.,2000

2. Ball grid array reliability assessment for aerospace applications;Ghaffarian;Microelectron. Reliab.,1999

3. Ghaffarian R. CSP assembly reliability, Circuits assembly, September; 1998. p. 36–42

4. Roesner B, Baraton X, Guttmann K, Samin C. Thermal fatigue of solder flip-chip assemblies. In: Electronic Components and Technology Conference 1998 Proceedings; 1998. p. 872–7

5. Thermal fatigue behavior of flip-chip joints with lead-free solders;Shohji;Mater. Trans.,2001

Cited by 37 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Automatic Solder Joint Failure Mode Analysis Based on Dye & Pry Image Processing;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Cyclic stress accelerated life test method for mechatronic products;Quality and Reliability Engineering International;2024-01

3. Height Measurement for Solder Ball Point Cloud;2023 2nd International Conference on Artificial Intelligence, Human-Computer Interaction and Robotics (AIHCIR);2023-12-08

4. Thermal creep and fatigue failure of the sintered silver solder in a SiC-IGBT module under power cycling;Engineering Failure Analysis;2023-12

5. Research on Acceleration Test Model and Parameter Determination Method of Integrated Circuit;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08