Ball grid array reliability assessment for aerospace applications-Reference-Cited by-同舟云学术

Ball grid array reliability assessment for aerospace applications

Published:1999-01 Issue:1 Volume:39 Page:107-112
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Ghaffarian R,Kim N.P

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference2 articles.

1. Ghaffarian R. Area array technology evaluation for space and military applications. In: The 1996 International Flip Chip Gall Grid Array, TAB and Advanced Packaging Symposium Proceedings, San Jose, February 13–16. Neffs (PA, USA): Semitech, 1996

2. Ghaffarian R. CBGA/PBGA package planarity and assembly reliability. In: The 1997 International Flip Chip Ball Grid Array, TAB and Advanced Packaging Symposium Proceedings, San Jose, February 17–19. Neffs (PA, USA): Semitech, 1997

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Finite Element Analysis of Super Ball Grid Array Packages Mounted in Printed Circuit Board;SoutheastCon 2024;2024-03-15

2. Effect of Aging Time on Ductile–Brittle Transition Behaviors of Sn-3.5Ag Solder;Journal of Electronic Materials;2022-10-26

3. A Wire Bondless SiC Switching Cell With a Vertically Integrated Gate Driver;IEEE Transactions on Power Electronics;2020-09

4. Analyses on the large size PBGA packaging reliability under random vibrations for space applications;Microelectronics Reliability;2020-06

5. Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation;International Journal of Aerospace Engineering;2018-10-08