Automatic Solder Joint Failure Mode Analysis Based on Dye & Pry Image Processing
Author:
Affiliation:
1. Western Digital,Milpitas,California,USA
2. Western Digital,Penang,Malaysia
Funder
Western Digital
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565153.pdf?arnumber=10565153
Reference19 articles.
1. Solder Joint Reliability of Double-Side Mounted DDR Modules for Consumer and Automotive Applications
2. Survey on Fatigue Life Prediction of BGA Solder Joints
3. Advanced 3D eWLB-PoP (Embedded Wafer Level Ball Grid Array - Package on Package) Technology
4. Comparative Study on Reliability and Advanced Numerical Analysis of BGA Subjected to Product-Level Drop Impact Test for Portable Electronics
5. High Reliability Solution of 2.5D Package Technologies
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