Author:
Xie Dongji,Hai Joe,Wu Zhongming,Economou Manthos
Cited by
2 articles.
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1. Automatic Solder Joint Failure Mode Analysis Based on Dye & Pry Image Processing;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Solder Joints in PCB Assembly and Semiconductor Packaging;Assembly and Reliability of Lead-Free Solder Joints;2020