Author:
Lin Hsin Jou,Lin Vito,Lin Joe,Lu Ying Ju,Wang David,Wang Yu Po
Cited by
13 articles.
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1. Development of Fabrication Technology for Large 2.5D Packages;Journal of The Japan Institute of Electronics Packaging;2024-08-01
2. Underfill Selection Guideline for Fan-Out Heterogeneous Integration Package;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Automatic Solder Joint Failure Mode Analysis Based on Dye & Pry Image Processing;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
4. Study of fabrication and reliability for 120 mm x 120 mm extremely large advanced 2.5D package;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
5. Thermo-Mechanical Reliability Characteristics of 8H HBM3;2024 IEEE International Reliability Physics Symposium (IRPS);2024-04-14