Underfill Selection Guideline for Fan-Out Heterogeneous Integration Package-Reference-Cited by-同舟云学术

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Underfill Selection Guideline for Fan-Out Heterogeneous Integration Package

Published:2024-05-28 Issue: Volume: Page:1993-1997
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Teng Wen-Yu¹,Hung Liang-Yih¹,Lee Jackson¹,Li Debby¹,Chen Carl²,Jiang Don-Son³,Wang Yu-Po²

Affiliation:

1. Siliconware Precision Industries Co., Ltd,Department of Material Engineering,Taichung City,Taiwan

2. Siliconware Precision Industries Co., Ltd,Package Appilication Corporate R&D,Taichung City,Taiwan

3. Siliconware Precision Industries Co., Ltd,Advanced Package Technoloty Corporate R&D,Taichung City,Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10564882.pdf?arnumber=10564882

Reference8 articles.

1. Stress and Reliability Challenges of Underfills in Large-Size Fan-Out Multichip Module Packages

2. Effect of Underfill Additive Agents on Crack Prevention in Large Fan-Out Multichip Module Packages

3. High Reliability Solution of 2.5D Package Technologies

4. Stress variation analysis during curing process of epoxy underfill

5. Recent Advances in Underfill for New Package Architectures

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