Development of Fabrication Technology for Large 2.5D Packages
Author:
Affiliation:
1. Resonac Corporation, Electronics Business Headquarters, Laminate Materials R&D Department
2. Resonac Corporation, Electronics Business Headquarters, Packaging Solution Center
Publisher
Japan Institute of Electronics Packaging
Link
https://www.jstage.jst.go.jp/article/jiep/27/5/27_375/_pdf
Reference12 articles.
1. 1) Imec technology forum USA 2020 "System interconnect scaling enabled by 3D and photonics technologies"
2. 2) F. Sheikh, R. Nagisetty, T. Karnik, and D. Kehlet: "2.5D and 3D Heterogeneous Integration: Emerging applications," in IEEE Solid-State Circuits Magazine, Vol. 13, No. 4, pp. 77–87, Fall 2021, doi: 10.1109/MSSC.2021.3111386
3. 3) W.-C. Chen, et al.: "Development of novel fine line 2.1 D package with organic interposer using advanced substrate-based process," 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 2018, pp. 601–606, doi: 10.1109/ECTC.2018.00095
4. 4) J. Kim, et al.: "Cost effective 2.3D packaging solution by using fanout panel level RDL," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 2021, pp. 310–314, doi: 10.1109/ECTC32696.2021.00059
5. 5) M. Kawano: "Technology Trends in 2.5D/3D Packaging and Heterogeneous Integration," 2021 IEEE 5th Electron Devices and Technology & Manufacturing Conference (EDTM), Chengu, China, 2021, pp. 1–3, doi: 10.1109/EDTM50988.2021.9421033
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