The Interplay of Creep Behaviour, Fatigue Failure, and Random Vibration: Implications for Solder Joint Reliability-Reference-Cited by-同舟云学术

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The Interplay of Creep Behaviour, Fatigue Failure, and Random Vibration: Implications for Solder Joint Reliability

Published:2023 Issue: Volume: Page:
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Author:

Depiver Joshua Adeniyi,Mallik Sabuj,Amalu Emeka H.

Publisher

Elsevier BV

Reference79 articles.

1. The influence of elevated temperature aging on reliability of lead free solder joints;H Ma;Proceedings -Electronic Components and Technology Conference,2007

2. Creep Damage of BGA Solder Interconnects Subjected to Thermal Cycling and Isothermal Ageing;J Depiver;Electronics Packaging Technology Conference IEEE,2019

3. Creep Response of Various Solders used in Soldering Ball Grid Array ( BGA ) on Printed;J A Depiver;IAENG,2019

4. The effects of SAC alloy composition on aging resistance and reliability;Y Zhang;Proceedings -Electronic Components and Technology Conference,2009

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