Effect of Ag3Sn on Fracture Behaviors of Sn-3.5Ag Lead-Free Solder during In Situ Tensile Test at Low Temperature
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
https://link.springer.com/content/pdf/10.1007/s11665-023-08532-x.pdf
Reference21 articles.
1. M. Abtew and G. Selvaduray, Lead-Free Solders in Microelectronics, Mater. Sci. Eng. R Rep., 2000, 27(5–6), p 95–141. (in English)
2. F. Gao and T. Takemoto, Mechanical Properties Evolution of Sn-3.5Ag Based Lead-Free Solders by Nanoindentation, Mater. Lett., 2006, 60(19), p 2315–2318. (in English)
3. A.K. Gain and L.C. Zhang, Thermal Aging Effects on Microstructure, Elastic Property and Damping Characteristic of a Eutectic Sn–3.5Ag Solder, J. Mater. Sci. Mater. Electron., 2018, 29(11), p 14519–14527. (in English)
4. M. Pourmajidian, R. Mahmudi, A.R. Geranmayeh, S. Hashemizadeh, and S. Gorgannejad, Effect of Zn and Sb Additions on the Impression Creep Behavior of Lead-Free Sn-3.5Ag Solder Alloy, J. Electron. Mater., 2015, 45(1), p 764–770. (in English)
5. I. Shohji, T. Yoshida, T. Takahashi, and S. Hioki, Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-07.5Cu Lead-Free Solders, Mater. Trans., 2002, 43(8), p 1854–1857. (in English)
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