Shear strengths and fracture behaviors of Cu/Sn37Pb/Cu soldered joints subjected to different displacement rates
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference22 articles.
1. 3D System-on-Chip technologies for More than Moore systems
2. Micro Cu Bump Interconnection on 3D Chip Stacking Technology
3. A Study on the Bonding Process of Cu Bump/Sn/Cu Bump Bonding Structure for 3D Packaging Applications
4. Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect
5. Electromigration induced ductile-to-brittle transition in lead-free solder joints
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4. Effects of Cu and In on the microstructure evolution and mechanical properties of Sn-20Bi/Cu solder joints;Journal of Materials Science: Materials in Electronics;2023-02
5. Contrastive Study on Shear Strength and Fracture Mechanism of Sn-9Zn-2.5Bi-1.5In and Sn-3.0Ag-0.5Cu Solder Joints with Aging Treatment;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
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