Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2402475
Reference19 articles.
1. Interfacial Morphology and Shear Deformation of Flip Chip Solder Joints
2. Materials issues in area-array microelectronic packaging
3. Recent advances on electromigration in very-large-scale-integration of interconnects
4. Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization
5. Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints
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1. Interfacial intermetallic compound modification to extend the electromigration lifetime of copper pillar joints;Frontiers in Materials;2023-01-04
2. Size Effect on the Electromigration Characteristics of Flip Chip Pb-free Solder Bumps;Electronic Materials Letters;2022-07-04
3. Effect of Ag Additives on the Consumption of a Cathode Cu Pad in a Cu/Sn3.5Ag/Cu Flip-Chip Structure Under Electromigration;Journal of Electronic Materials;2021-10-11
4. Electromigration in solder joints: A cross-sectioned model system for real-time observation;Microelectronics Reliability;2021-04
5. Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview;Journal of Micromanufacturing;2019-12-17
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