Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1616993
Reference11 articles.
1. Future challenges in electronics packaging
2. Electromigration in Sn–Pb solder strips as a function of alloy composition
3. Electromigration of eutectic SnPb solder interconnects for flip chip technology
4. Current-crowding-induced electromigration failure in flip chip solder joints
5. Electromigration—A brief survey and some recent results
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