Electromigration of eutectic SnPb solder interconnects for flip chip technology
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1342023
Reference9 articles.
1. Future challenges in electronics packaging
2. Electromigration in metals
3. Copper interconnections and reliability
4. Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes
5. Electromigration in stressed thin films
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2. Influence of Microstructure Evolution on the Current Density and Temperature Gradient of Line-Type Cu/Sn58Bi/Cu Microscale Solder Joints Under Current Stressing;Journal of Electronic Materials;2022-01-02
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4. Influence of microstructure inhomogeneity on the current density and temperature gradient in microscale line-type Sn58Bi solder joints under current stressing;Microelectronics Reliability;2020-12
5. Design and Validation of Reliability Physics for Interconnect Architectures Induced from Inclusive TM/SM/EM Effects;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
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