Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.124276
Reference5 articles.
1. Electromigration in metals
2. Copper interconnections and reliability
3. Interface diffusion in eutectic Pb–Sn solder
4. Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions
5. Current-induced marker motion in gold wires
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2. Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature;Applied Sciences;2020-12-13
3. Microstructural evolution and change in macroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and elastic stress;Journal of Materials Research;2019-07-16
4. Ni Barrier Symmetry Effect on Electromigration Failure Mechanism of Cu/Sn–Ag Microbump;Electronic Materials Letters;2018-12-12
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