Recent advances on electromigration in very-large-scale-integration of interconnects
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1611263
Reference68 articles.
1. Electromigration in metals
2. Copper interconnections and reliability
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5. Reduction of Electromigration in Aluminum Films by Copper Doping
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