3D System-on-Chip technologies for More than Moore systems-Reference-Cited by-同舟云学术

3D System-on-Chip technologies for More than Moore systems

Published:2009-12-18 Issue:7 Volume:16 Page:1051-1055
ISSN:0946-7076
Container-title:Microsystem Technologies
language:en
Short-container-title:Microsyst Technol

Author:

Ramm Peter,Klumpp Armin,Weber Josef,Taklo Maaike M. V.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s00542-009-0976-1.pdf

Reference8 articles.

1. Arkalgud S (2008) SEMATECH 3-D TSV technology development. In: Proceedings of the international 3D system integration conference 3D-SIC 2008. Tokyo, Japan

2. e-CUBES project (2009) http://www.ecubes.org

3. Garrou P, Bower C, Ramm P (2008) Handbook of 3D integration. Wiley-VCH, New York, ISBN: 978-3-527-32034-9

4. I-micronews (Yole Developpement) (2008) 3D IC, WLP and TSV packaging newsletter. http://www.imicronews.com

5. International Technology Roadmap for Semiconductors (ITRS) (2007) http://www.public.itrs.net

Cited by 44 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Performance enhancement of junctionless silicon nanotube gate-all-around FETs for nano-scaled devices;Multiscale and Multidisciplinary Modeling, Experiments and Design;2024-03-29

2. TSV wafer warpage simulation and process induced strain prediction by machine learning-based anisotropic equivalent modeling method;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

3. Void-free interface between In and high-impurity Cu joint;Science and Technology of Welding and Joining;2023-09-20

4. Fabrication and Characterization of Thin Metal Films Deposited by Electroless Plating with Organic Additives for Electrical Circuits Applications;Micromachines;2023-05-29

5. An inter-scale simulation method for TSV 3D IC based on linear superposition algorithm and TSV model sharing strategy;Microelectronics Reliability;2023-05