Handbook of 3D Integration

Author:

Garrou Philip,Bower Christopher,Ramm Peter

Publisher

Wiley

Cited by 102 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Flip-chip technology at room temperature: A new design of microtube-based interconnect for improved mechanical and electrical properties;Sensors and Actuators A: Physical;2024-10

2. Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review;Materials;2023-12-14

3. LOTS: Low Overhead TSV Repair Method Using IEEE-1838 Standard Architecture;2023 20th International SoC Design Conference (ISOCC);2023-10-25

4. ANALYSIS OF DESIGNS OF 3D MICROCIRCUITS WITH END-TYPE SWITCHING;Прогрессивное развитие как следствие научно-технических исследований: сборник статей международной научной конференции (Новосибирск, Ноябрь 2022);2022-12-27

5. Diffusion Enhanced Optimized Thin Passivation Layer for Realizing Copper to Copper Wafer Bonding at Low Thermal Budget;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

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