Design and Simulation of Deep Trench Capacitor on High-Performance Silicon Interposer
Author:
Affiliation:
1. Tsinghua University,School of Integrated Circuits,Beijing,China
2. Beijing National Research Center for Information Science and Technology,Beijing,China
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873472.pdf?arnumber=9873472
Reference24 articles.
1. Effective Radii of On-Chip Decoupling Capacitors
2. A new approach to power integrity with thinfilm capacitors in 3D IPAC functional module
3. Recent advances in electromagnetic compatibility of 3D-ICs — Part II
4. Performance analysis and modeling of deep trench decoupling capacitor for 32 nm high-performance SOI processors and beyond
5. Deep Trench Capacitors in Silicon Interconnect Fabric
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