Author:
Jayaraman Balaji,Gupta Sneha,Zhang Yanli,Goyal Puneet,Ho Herbert,Krishnan Rishikesh,Fang Sunfei,Lee Sungjae,Daley Douglas,McStay Kevin,Wunder Bernhard,Barth John,Deshpande Sadanand,Parries Paul,Malik Rajeev,Agnello Paul,Stiffler Scott,Iyer Subramanian S.
Cited by
4 articles.
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1. On-Board and On-Package Active Capacitors for High Current Systems;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-09
2. Design and Simulation of Deep Trench Capacitor on High-Performance Silicon Interposer;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
3. Energy-Efficient High-Speed SAR ADCs in CMOS;High-Performance AD and DA Converters, IC Design in Scaled Technologies, and Time-Domain Signal Processing;2014-07-24
4. TSV Decoupling Schemes;Electrical Design of Through Silicon Via;2014