Funder
Guangxi Natural Science Foundation
National Natural Science Foundation of China
Dalian High-Level Talent Innovation Program
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference42 articles.
1. Y.A. Shen, S. Zhou, J. Li, C.H. Yang, S. Huang, S.K. Lin, H. Nishikawa, Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology. Mater. Design 183, 101814 (2019)
2. Y.F. Gao, C.Q. Cheng, J. Zhao, L.H. Wang, X.G. Li, Electrochemical corrosion of Sn-0.75Cu 75Cu solder joints in NaCl solution. Trans. Nonferrous Met. Soc. China 22(4), 977–982 (2012)
3. M.K. Pal, G. Gergely, D.K. Horváth, Z. Gácsi, Investigation of microstructure and wetting behavior of on copper Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with additions of 1.0 wt. % SiC substrate. Intermetallics 128(1), 106991 (2021)
4. X. Mao, R. Zhang, X. Hu, Influence of Ni foam/Sn composite solder foil on IMC growth and mechanical properties of solder joints bonded with solid-liquid electromigration. Intermetallics 131, 107107 (2021)
5. P. He, X.C. LÜ, T.S. Lin, H.X. Li, J. An, X. Ma, J.C. Feng, Y. Zhang, Q. Li, Y.Y. Qian, Improvement of mechanical properties of Sn-58Bi alloy with multi-walled carbon nanotubes. Trans. Nonferrous. Met. Soc. China 22, s692–s696 (2012)
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