Investigation of microstructure and wetting behavior of Sn–3.0Ag–0.5Cu (SAC305) lead-free solder with additions of 1.0 wt % SiC on copper substrate-Reference-Cited by-同舟云学术

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Investigation of microstructure and wetting behavior of Sn–3.0Ag–0.5Cu (SAC305) lead-free solder with additions of 1.0 wt % SiC on copper substrate

Published:2021-01 Issue: Volume:128 Page:106991
ISSN:0966-9795
Container-title:Intermetallics
language:en
Short-container-title:Intermetallics

Author:

Pal Manoj Kumar,Gergely Gréta,Koncz-Horváth Dániel,Gácsi Zoltán

Funder

European Union

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry

Reference52 articles.

1. Investigation of small Sn-3.5Ag-0.5Cu additions on the microstructure and properties of Sn-8Zn-3Bi solder on Au/Ni/Cu pads;Gain;J. Alloys Compd.,2010

2. Interfacial compounds growth of SnAgCu(nano La2O3)/Cu solder joints based on experiments and FEM;Zhang;J. Alloys Compd.,2015

3. Investigation of the electroless nickel plated sic particles in SAC305 solder matrix;Pal;Powder Metall. Met. Ceram.,2020

4. Thermomechanical behaviour of environmentally benign Pb-free solders;Chawla;Int. Mater. Rev.,2009

5. Phase reaction in Sn-9Zn solder with Ni/Au surface finish bond-pad at 175 °C ageing;Chang;J. Alloys Compd.,2007

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1. Nanoparticle-reinforced solder alloys: A comprehensive review of recent formulation properties, and mechanical performance;Journal of Materials Research and Technology;2024-09

2. Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging;Engineering Fracture Mechanics;2024-08

3. Effect of Co-W and Co-Fe-W Diffusion Barriers on the Reliability of the Solder/Cu Interface during Reflow Conditions;Electronic Materials Letters;2024-04-13

4. Self-Healing of Kirkendall Voids and IMC Growth in the Interfacial Reaction of Novel Ni/Cu bi-layer Barrier and Solder;Electronic Materials Letters;2024-04-03

5. Investigation on wetting behavior of Cu/Sn systems by molecular dynamics simulation;Results in Surfaces and Interfaces;2024-04

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