Phase reaction in Sn–9Zn solder with Ni/Au surface finish bond-pad at 175°C ageing
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference12 articles.
1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2. 2-Step algorithm for automatic alignment in wafer dicing process
3. Analysis on interfacial reactions between Sn–Zn solders and the Au/Ni electrolytic-plated Cu pad
4. Interfacial reactions and impact reliability of Sn–Zn solder joints on Cu or electroless Au/Ni(P) bond-pads
5. Ductile-to-brittle transition in Sn–Zn solder joints measured by impact test
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2. Bonding mechanism of lead-free solder and glass plate by ultrasonic assisted soldering method;Materials & Design (1980-2015);2015-01
3. Thermodynamic re-assessment of the Ni – Sn system;International Journal of Materials Research;2013-01-01
4. Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1wt% nano-TiO2 composite solder on flexible ball grid array substrates;Microelectronics Reliability;2011-05
5. Interfacial Reactions, Microstructure, and Strength of Sn-8Zn-3Bi and Sn-9Zn-Al Solder on Cu and Au/Ni (P) Pads;Metallurgical and Materials Transactions A;2009-11-25
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