Analysis on interfacial reactions between Sn–Zn solders and the Au/Ni electrolytic-plated Cu pad
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference12 articles.
1. Lead-free Solders in Microelectronics
2. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
3. Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review
4. Electromigration effect upon the Zn/Ni and Bi/Ni interfacial reactions
5. Interface reaction between copper and molten tin–lead solders
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2. Study of Interfacial Reactions Between Lead-Free Solders and Cu-xZn Alloys;Journal of Electronic Materials;2018-08-13
3. Electrochemical Corrosion Behavior, Microstructure and Soldering Properties of Tin Based Alloys;Material Science Research India;2018-02-01
4. Wetting of Sn-Zn-Ga and Sn-Zn-Na Alloys on Al and Ni Substrate;Journal of Electronic Materials;2017-09-15
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