Self-Healing of Kirkendall Voids and IMC Growth in the Interfacial Reaction of Novel Ni/Cu bi-layer Barrier and Solder
Author:
Funder
National Basic Research Program of China
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s13391-024-00492-1.pdf
Reference37 articles.
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2. Liu, Y., Chu, Y.-C., Tu, K.-N.: Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 µm diameter. Acta Mater. 117, 146–152 (2016). https://doi.org/10.1016/j.actamat.2016.07.004
3. Pal, M.K., Bajaj, V.: Nucleation and location of Kirkendall Voids at the tin-based Solder/Copper Joint: A review. Adv. Eng. Mater. 2300671 (2023). https://doi.org/10.1002/adem.202300671
4. Huang, T., Liu, S., Ling, H., Li, M., Hu, A., Gao, L., Hang, T.: Growth behavior and morphology of sidewall intermetallic compounds in Cu/Ni/sn-Ag microbumps during multiple reflows. Mater. Lett. 326, 132887 (2022). https://doi.org/10.1016/j.matlet.2022.132887
5. Chen, J., Yang, J., Zhang, Y., Yu, Z., Zhang, P.: Effect of substrates on the formation of Kirkendall voids in Sn/Cu joints. Weld. World. 63, 751–757 (2019). https://doi.org/10.1007/s40194-019-00704-5
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