Improvement of mechanical properties of Sn–58Bi alloy with multi-walled carbon nanotubes-Reference-Cited by-同舟云学术

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Improvement of mechanical properties of Sn–58Bi alloy with multi-walled carbon nanotubes

Published:2012-12 Issue: Volume:22 Page:s692-s696
ISSN:1003-6326
Container-title:Transactions of Nonferrous Metals Society of China
language:en
Short-container-title:Transactions of Nonferrous Metals Society of China

Author:

HE Peng,LÜ Xiao-chun,LIN Tie-song,LI Hai-xin,AN Jing,MA Xin,FENG Ji-cai,ZHANG Yan,LI Qi,QIAN Yi-yu

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference15 articles.

1. Effect of carbon nanotubes on the shear strength and electrical resistivity of a lead-free solder [J];NAI;Journal of Electronic Materials,2008

2. Lead-free solder reinforced with multi-walled crabon nanotubes [J];NAI;Journal of Electronic Materials,2006

3. Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders [J];KUMAR;Journal of Alloys and Compounds,2008

4. Influence of single-wall carbon nanotube addition on the microstructural and tensile properties of Sn-Pb solder alloy [J];KUMAR;Journal of Alloys and Compounds,2008

5. Influence of Ag addition to Sn-Bi eutectic alloy on microstructure and on mechanical properties [J];SU;Journal of Japan Institute of Electronics Packaging,2003

Cited by 31 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of soldering temperatures and composition on the microstructures and shear properties of Sn58Bi-xSAC0307/ENIG solder joints;Soldering & Surface Mount Technology;2024-07-25

2. Influence of Sb on the Performance and Interfacial Behavior of SnBiAg-xSb/Cu Solder Joints;Journal of Electronic Materials;2023-09-22

3. Effect of multi-walled carbon nanotubes on the microstructure and properties of Sn-58Bi solder alloys;Journal of Adhesion Science and Technology;2023-06-21

4. Effect of Carbon Nanotubes on the Mechanical, Thermal, and Electrical Properties of Tin-Based Lead-Free Solders: A Review;Crystals;2023-05-09

5. Effects of Cu and In on the microstructure evolution and mechanical properties of Sn-20Bi/Cu solder joints;Journal of Materials Science: Materials in Electronics;2023-02

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