Contrastive Study on Shear Strength and Fracture Mechanism of Sn-9Zn-2.5Bi-1.5In and Sn-3.0Ag-0.5Cu Solder Joints with Aging Treatment
Author:
Affiliation:
1. Tsinghua University,Department of Mechanical Engineering,Beijing,China,100084
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873452.pdf?arnumber=9873452
Reference13 articles.
1. Effect of Bi on the microstructure and mechanical properties of Sn-Zn alloys processed by rolling
2. Katsuaki Suganuma, Thermal property, wettability and interfacial characterization of novel Sn–Zn–Bi–In alloys as low-temperature lead-free solders, Mater;liu;Design,2015
3. Interfacial reactions and shear strength on Cu and electrolytic Au/Ni metallization with Sn-Zn solder
4. The effect of Ag content on the formation of Ag3Sn plates in Sn-Ag-Cu lead-free solder
5. Effects of static thermal aging and thermal cycling on the microstructure and shear strength of Sn95.5Ag3.8Cu0.7 solder joints;ahat;J Mater Res,2001
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