Structure and properties of Sn-Cu lead-free solders in electronics packaging-Reference-Cited by-同舟云学术

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Structure and properties of Sn-Cu lead-free solders in electronics packaging

Published:2019-05-07 Issue:1 Volume:20 Page:421-444
ISSN:1468-6996
Container-title:Science and Technology of Advanced Materials
language:en
Short-container-title:Science and Technology of Advanced Materials

Author:

Zhao Meng¹,Zhang Liang¹^ORCID,Liu Zhi-Quan²^ORCID,Xiong Ming-Yue¹,Sun Lei³

Affiliation:

1. School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou, China

2. Institute of Metal Research, Chinese Academy of Sciences, Shenyang, China

3. College of Mechanical & Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing, China

Funder

National Key R&D Program of China

Natural Science Foundation of China

Key project of State Key Laboratory of Advanced Welding and Joining

Six talent peaks project in Jiangsu Province

the Qing Lan Project, the China Postdoctoral Science Foundation funded project

International Cooperation Project

Publisher

Informa UK Limited

Subject

General Materials Science

Link

https://tandfonline.com/doi/pdf/10.1080/14686996.2019.1591168

Reference128 articles.

1. Enhancing overall mechanical performance of metallic materials using two-directional microwave assisted rapid sintering

2. Six cases of reliability study of Pb-free solder joints in electronic packaging technology

3. Effects of mechanical deformation and annealing on the microstructure and hardness of Pb-free solders

4. The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging

5. The relation between valency, axial ratio, Young’s modulus and resistivity of rapidly solidified tin-based eutectic alloys

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