The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging-Reference-Cited by-同舟云学术

The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging

Published:2009-03 Issue:3 Volume:49 Page:288-295
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Seo Sun-Kyoung,Kang Sung K.,Shih Da-Yuan,Lee Hyuck Mo

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. Lead(Pb)-free solders for electronic packaging;Kang;J Electron Mater,1994

2. Interfacial microstructure and joint strength of Sn-3. 5Ag–X (X=Cu, In and Ni) solder joint;Choi;J Mater Res,2002

3. Comparison of Sn2. 8Ag20In and Sn10Bi10In solders for intermediate step soldering;Seo;J Electron Mater,2006

4. Effects of minor addition of Zn on interfacial reactions of Sn–Ag–Cu and Sn–Cu solders with various Cu substrates during thermal aging;Cho;J Electron Mater,2007

5. Effects of Co addition on bulk properties of Sn–3.5Ag solder and interfacial reactions with Ni-P UBM;Kim;J Electron Mater,2009

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