Advanced Assembly of Miniaturized Surface Mount Technology Components Using Nano-reinforced Solder Paste
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Publisher
Springer International Publishing
Link
https://link.springer.com/content/pdf/10.1007/978-3-030-93441-5_6
Reference30 articles.
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2. Che Ani, F., Jalar, A., Saad, A. A., et al. (2018a). The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly. International Journal of Advanced Manufacturing Technology, 96, 717–733. https://doi.org/10.1007/s00170-018-1583-z
3. Che Ani, F., Jalar, A., Saad, A. A., et al. (2018b). SAC–xTiO 2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly. Soldering & Surface Mount Technology, 30, 1–13. https://doi.org/10.1108/SSMT-04-2017-0011
4. Che Ani, F., Jalar, A., Saad, A. A., et al. (2019). Characterization of SAC—x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly. Soldering & Surface Mount Technology, 31, 109–124. https://doi.org/10.1108/SSMT-08-2018-0024
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