Microstructure and mechanical properties of Pb-free Sn–3.0Ag–0.5Cu solder pastes added with NiO nanoparticles after reflow soldering process
Author:
Funder
Ministry of Higher Education, Malaysia
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference45 articles.
1. Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process;Srivalli;Mater. Des.,2015
2. A review: influence of nanoparticles reinforced on solder alloy;Ervina;Soldering Surf. Mount Technol.,2013
3. Development of Sn–Zn lead-free solders bearing alloying elements;Zhang;J. Mater. Sci. Mater. Electron.,2010
4. Thermal and mechanical properties of Sn–Zn–Bi lead-free solder alloys;El-Daly;J. Alloys Compd.,2009
5. Properties of low melting point Sn–Zn–Bi solders;Zhou;J. Alloys Compd.,2005
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