Effects of mechanical deformation and annealing on the microstructure and hardness of Pb-free solders-Reference-Cited by-同舟云学术

Effects of mechanical deformation and annealing on the microstructure and hardness of Pb-free solders

Published:2003-12 Issue:12 Volume:32 Page:1432-1440
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Lauro Paul,Kang Sung K.,Choi Won Kyoung,Shih Da-Yuan

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-003-0112-4.pdf

Reference18 articles.

1. S.K. Kang and A. Sarkhel, J. Electron. Mater. 23, 701 (1994).

2. C.M. Miller, I.E. Anderson, and J.F. Smith, J. Electron. Mater. 23, 595 (1994).

3. P.T. Vianco and C. May, Proc. Surface Mount Int. Conf. (Edina, MN: Surface Mount International, 1995), pp. 481–494.

4. R. Ninomiya, K. Miyake, and J. Matsunaga, Proc. Inter-PACK’97 (New York: ASME, 1997), pp. 1329–1334.

5. National Center for Manufacturing Sciences, Lead-Free Solder Project Final Report (Ann Arbor, MI: National Center for Manufacturing Sciences, 1997).

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