Quantitative Microstructural Data of Bulk Solders and Joints under a New Framework of MicroStructure Hierarchy Descriptor (μSHD)-Reference-Cited by-同舟云学术

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Quantitative Microstructural Data of Bulk Solders and Joints under a New Framework of MicroStructure Hierarchy Descriptor (μSHD)

Published:2023-08-08 Issue: Volume: Page:1-6
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Zheng Kaiwen¹,Huang Zhiheng¹,Xiao Min¹,Meng Yuezhong¹,Yan Hui²,Liu Yang³

Affiliation:

1. Sun Yat-sen University,The Key Laboratory of Low-Carbon Chemistry & Energy Conservation of Guangdong Province, and School of Materials Science and Engineering,Guangzhou,China

2. Sun Yat-sen University,School of Computer Science and Engineering,Guangzhou,China

3. Sun Yat-sen University,School of Electronics and Information Technology,Guangzhou,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492095.pdf?arnumber=10492095

Reference21 articles.

1. Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization

2. Electromigration failure in flip chip solder joints due to rapid dissolution of copper

3. Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength

4. The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

5. Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 μm diameter

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