1. Lead‐free reflow soldering for electronics assembly
2. IEEE Proceedings of 2003 Electronic Components and Technology Conference;Bradley,2003
3. J.H.L. Pang, B.S. Xiong and H. Kurniawijaya, Mechanical strength of lead-free solder, Proceedings of Globaltronics Technology Conference 2002, Singapore, pp. 113–118, ISBN No. 981-04-7144-0.
4. IEEE Proceedings of 2003 Electronic Components and Technology Conference;Pang,2003