Examination the effect of thermal shock test on SAC solder joints fabricated by THRS and multiwave soldering techniques
Author:
Affiliation:
1. Institute of Physical Metallurgy, Metalforming and Nanotechnology, University of Miskolc, Miskolc, Hungary
2. FUX Corporation Hungary, Miskolc, Hungary
Publisher
Akademiai Kiado Zrt.
Link
https://www.akademiai.com/doi/pdf/10.1556/2051.2019.00058
Reference52 articles.
1. Effects of mechanical deformation and annealing on the microstructure and hardness of Pb-free solders
2. A numerical method for predicting intermetallic layer thickness developed during the formation of solder joints
3. Effect of crystallographic anisotropy ofβ-tin grains on thermal fatigue properties of Sn–1Ag–0˙5Cu and Sn–3Ag–0˙5Cu lead free solder interconnects
4. Early stages of localized recrystallization in Pb-free BGA solder joints subjected to thermomechanical stress
5. Early stages of localized recrystallization in Pb-free BGA solder joints subjected to thermomechanical stress
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Density and Dynamic Viscosity of Sn, Sn–Ag, and Sn–Ag–Cu Liquid Lead-Free Solder Alloys;Powder Metallurgy and Metal Ceramics;2021-11
2. Characterization of the interface between ceramics reinforcement and lead-free solder matrix;Surfaces and Interfaces;2020-09
3. An experimental study of carbonyl powder power inductor cracking during reflow process;Soldering & Surface Mount Technology;2020-07-14
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3