Early stages of localized recrystallization in Pb-free BGA solder joints subjected to thermomechanical stress-Reference-Cited by-同舟云学术

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Early stages of localized recrystallization in Pb-free BGA solder joints subjected to thermomechanical stress

Published:2017-05 Issue: Volume:704 Page:574-584
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Han J.,Guo F.,Liu J.P.

Funder

National Natural Science Foundation

Beijing Natural Science Foundation

Science and Technology Project of Beijing Municipal Education Commission

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference34 articles.

1. The effect of cooling rate on grain orientation and misorientation microstructure of SAC105 solder joints before and after impact drop test;Darbandi;J. Electron. Mater.,2014

2. Sn-Ag-Cu solder joint microstructure and orientation evolution as a function of position and thermal cycles in ball grid arrays using orientation imaging microscopy;Lee;J. Electron. Mater.,2010

3. Crack development in a low-stress PBGA package due to continuous recrystallization leading to formation of orientations with 001 parallel to the interface;Zhou;J. Electron. Mater.,2010

4. Microstructure and Sn crystal orientation evolution in Sn-3.5Ag lead-free solders in high-temperature packaging applications;Zhou;J. Electron. Mater.,2014

5. The role of recrystallization in the failure of SnAgCu solder interconnections under thermomechanical loading;Mattila;IEEE Trans. Compon. Packag. Technol.,2010

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1. Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges;Journal of Electronic Materials;2024-03-08

2. Region optimization and sensitivity analysis of THT assembly process parameters based on flexible soldering robot platform;Xibei Gongye Daxue Xuebao/Journal of Northwestern Polytechnical University;2024-02

3. Synergistic effect of MWCNT addition on the thermal and elastic properties of Sn–5Sb–0.3Cu alloy;Journal of Materials Science: Materials in Electronics;2023-12

4. Thermal cycle reliability and creep behavior of nano-IMC mixed solder joints;Journal of Materials Science: Materials in Electronics;2023-10

5. Effect of nano-intermetallic compound on creep properties and β-Sn grain recrystallization of Cu/Sn-Ag-Cu/Ni solder joints;Materials Today Communications;2023-08

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